MIL-STD-883 Testing                   Submit Online RFQ

The MIL-STD-883 standard establishes uniform methods, controls and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices.

Advanced Component Testing has been audited for Lab Suitability by the Defense Logistics Agency (DLA) for testing of MIL-SPEC product being procured by the U.S. Government.* ACT is one of few qualified and approved labs for processing and testing of components, leading the industry with testing certifications and credentials to test to MIL-STD-202 as well as MIL-STD-750 and MIL-STD-883 methods.

MIL-STD-883 Test Methods for Electronic/Electrical Components – Performed by ACT

1003      Insulation Resistance

1005      Steady State Life test

1006      Intermittent Life test

1008      Stabilization Bake

1010      Temperature Cycling

1011      Thermal Shock

1014      Seal (Fine and Gross leak test)

1015      Burn-in test

2001      Constant acceleration

2002      Mechanical Shock

2003*    Solderability

2004      Lead integrity

2005      Vibration fatigue

2007      Vibration variable frequency

2008      Visual and Mechanical inspection

2009      External Visual inspection

2010      Internal visual inspection (Monolithic devices)

2011      Bond strength (destructive bond pull test)

2012      Radiography (X-Ray)

2013      Internal visual inspection (DPA)

2014      Internal visual and mechanical

2015*    Resistance to Solvents

2016      Physical dimensions

2017      Internal visual for Hybrid devices

2018      Scanning electron microscope inspection (SEM)

2019      Die Shear Strength

2020      Particle impact noise detection (PIND)

2026      Random Vibration

2028      Pin grid destructive lead pull test

2032      Visual inspection of passive elemens

2036      Resistance to soldering heat

2037      X-Ray fluorescence Scan (XRF)

3005      Power Supply Current

3006      High level output voltage

3007      Low level output voltage

3008      Input or Output Breakdown Voltage

3009      Low level input current

3010      High level input current

3011      Output short circuit current

3012      Terminal capacitance

3014      Functional testing

3016      Activation time verification

3018      Crosstalk measurements for digital devices

3020      High impendence low-level output leakage current

3021      High impendence high-level output leakage current

3022      Input clamp voltage

4001      Input offset voltage and bias current

4002      Phase margin and slew rate

4003      Common mode and power supply rejection ratios

4004      Open loop performance

4005      Output performance

4007      Automatic gain control range


*The Defense Logistics Agency has issued ACT a Land and Maritime-VQ letter of suitability for testing to these methods.

Related Links: 8  MIL-STD-202     8  MIL-STD-750     8  Military Test Plans