MIL-STD-750 Testing Submit Online RFQ
MIL-STD-750(F) establishes uniform methods and procedures for testing semiconductor devices suitable for use within military and aerospace electronic systems. The methods and procedures in the various parts of this standard include basic environmental, physical and electrical tests for determining resistance to deleterious effects of natural elements and conditions surrounding military and space operations.
Advanced Component Testing has been audited for Lab Suitability by the Defense Logistics Agency (DLA) for testing of MIL-SPEC product being procured by the U.S. Government.* ACT is one of few qualified and approved labs for processing and testing of components, leading the industry with testing certifications and credentials to test to MIL-STD-750 as well as MIL-STD-202 and MIL-STD-883 methods.
MIL-STD-750 Test Methods for Semiconductor Devices – Performed by ACT
1016 Insulation resistance
1022 Resistance to solvents
1026 Steady state operation life
1027 Steady state operation life (sample plan)
1031 High-temperature life test (nonoperating)
1032 High-temp life test (nonop/Sample plan)
1033 Reverse voltage leakage stability
1036 Intermittent Life
1037 Intermittent Life (sample plan)
1038 Burn-in for diodes, rectifiers and zeners
1039 Burn-in for transistors
1040 Burn-in for thyristors
1042 Burn-in and life test for power MOSFET/IGBT
1048 Blocking Life
1049 Blocking Life (sample plan)
1051 Temperature cycling
1055 Monitored mission temperature cycling
1071 Hermetic seal
1081 Dielectrica withstanding voltage
2026 Solderability
2031 Resistance to soldering heat
2037 Bond strength (destructive bond pull test)
2066* Physical dimensions
2068 External visual inspection
2071 Visual and Mechanincal inspection
2073 Visual inspection for Die (diodes)
2074 Internal visual inspection (discretes)
2075 Decap and internal visual inspection, design verification
2076 Radiography
2077 Scanning electron microscope inspection (SEM)
2078 Internal visual for wire bonded diodes
2100 X-ray fluorescence scan
2101 Destructive physical analysis (diodes)
2102 Destructive physical analysis (wire bonded devices)
2103 Design verification for surface mount devices
3001* Breakdown voltage, collector to base
3005 Burnout by pulsing
3011* Breakdown voltage, collector to emitter
3015 Drift
3020 Floating potential
3026* Breakdown voltage, collector to base
3030 Collector to emitter voltage
3036 Collector to base cutoff current
3041 Collector to emitter cutoff current
3051 Safe operating area (continuous DC)
3052 Safe operating area (pulsed)
3053 Safe operating area (switching)
3061 Emitter to base cutoff current
3066 Base emitter voltage (saturated or nonsat)
3071 Saturation voltage and resistance
3076 Forward-current transfer ratio
3086 Static input resistance
3092 Static transconductance
3201 Small-signal, short-circuit input impedance
3206 Small-signal, short-circuit forward-current transfer ratio
3211 Small-signal, open-circuit reverse-voltage transfer ratio
3216 Small-signal, open-circuit output admittance
3221 Small-signal, short-circuit input admittance
3231 Small-signal, short-circuit output admittance
3236 Open-circuit output capacitance
3240 Input capacitance (output open- or short-circuited)
3246 Noise figure
3251 Pulse response
3255 Large-signal power gain
3256 Small-signal power gain
3261 Extrapolated unity-gain frequency
3401 Breakdown voltage, gate-to-source
3402 MOSFET gate equivalent series resistance
3403 Gate-to-source voltage or current
3404 MOSFET threshold voltage
3405 Drain-to-source on-state voltage
3407 Breakdown voltage, drain-to-source
3411 Gate reverse current
3413 Drain current
3415 Drain reverse current
3421 Static drain-to-source on-state resistance
3423 Small-signal, drain-to-source on-state resistance
3431 Small-signal, common-source, short-circuit, input capacitance
3433 Small-signal, common-source, short-circuit, reverse transfer capacitance
3453 Small-signal, common-source, short-circuit, output admittance
3455 Small-signal, common-source, short-circuit, forward transadmittance
3457 Small-signal, common-source, short-circuit, reverse transfer admittance
3459 Pulse response field-effect transistor (FET)
3461 Small-signal, common-source, short-circuit, input admittance
3469 Repetitive unclamped inductive switching
3470 Single pulse unclamped inductive switching
3471 Gate charge
3472 Switching time test
3473 Reverse recovery time (trr) and recovered charge (qrr) for power MOSFET (drain-to-source)
3474 Safe operating area for power MOSFETs or insulated gate bipolar transistors
3475 Forward transconductance (pulsed dc method) of power MOSFETs or insulated gate bipolar transistors
3477 Measurement of insulated gate bipolar transistor total switching losses and switching times
3478 Power transistor electrical dose rate
3479 Short-circuit withstand time
3501 Breakdown voltage, drain-to-source
3505 Maximum available gain of a GaAs FET
3570 GaAs FET forward gain
3575 Forward transconductance
4001* Capacitance
4011* Forward voltage
4016* Reverse current leakage
4021* Breakdown voltage (diodes)
4022* Breakdown voltage (voltage regulators and voltage-reference diodes)
4026 Forward recovery voltage and time
4031 Reverse recovery characteristics
4036 Quality factor (Q) for voltage variable capacitance diodes
4041 Rectification efficiency
4046 Reverse current, average
4051 Small-signal reverse breakdown impedance
4056 Small-signal forward impedance
4061 Stored charge
4064 Inductive avalanche energy test for diodes
4065 Peak reverse power test
4066 Surge current and impulse clamp voltage
4071 Temperature coefficient of breakdown voltage
4076 Saturation current
4081 Thermal resistance of diodes (forward voltage, switching method)
4201 Holding current
4206 Forward blocking current
4211 Reverse blocking current
4216 Pulse response
4219 Reverse gate current
4221 Gate-trigger voltage
4223 Gate-controlled turn-on time
4224 Circuit-commutated turn-off time
4225 Gate-controlled turn-off time
4226 Forward on voltage
4231 Exponential rate of voltage rise
4301 Junction capacitance
4306 Static characteristics of tunnel diodes
4326 Series resistance
4331 Switching time
*The Defense Logistics Agency has issued ACT a Land and Maritime-VQ letter of suitability for testing to these methods.
Related Links: 8 MIL-STD-202 8 MIL-STD-883 8 Military Test Plans