MIL-STD-883 Testing Submit Online RFQ
The MIL-STD-883 standard establishes uniform methods, controls and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices.
Advanced Component Testing has been audited for Lab Suitability by the Defense Logistics Agency (DLA) for testing of MIL-SPEC product being procured by the U.S. Government.* ACT is one of few qualified and approved labs for processing and testing of components, leading the industry with testing certifications and credentials to test to MIL-STD-202 as well as MIL-STD-750 and MIL-STD-883 methods.
MIL-STD-883 Test Methods for Electronic/Electrical Components – Performed by ACT
1003 Insulation Resistance
1005 Steady State Life test
1006 Intermittent Life test
1008 Stabilization Bake
1010 Temperature Cycling
1011 Thermal Shock
1014 Seal (Fine and Gross leak test)
1015 Burn-in test
2001 Constant acceleration
2002 Mechanical Shock
2003* Solderability
2004 Lead integrity
2005 Vibration fatigue
2007 Vibration variable frequency
2008 Visual and Mechanical inspection
2009 External Visual inspection
2010 Internal visual inspection (Monolithic devices)
2011 Bond strength (destructive bond pull test)
2012 Radiography (X-Ray)
2013 Internal visual inspection (DPA)
2014 Internal visual and mechanical
2015* Resistance to Solvents
2016 Physical dimensions
2017 Internal visual for Hybrid devices
2018 Scanning electron microscope inspection (SEM)
2019 Die Shear Strength
2020 Particle impact noise detection (PIND)
2026 Random Vibration
2028 Pin grid destructive lead pull test
2032 Visual inspection of passive elemens
2036 Resistance to soldering heat
2037 X-Ray fluorescence Scan (XRF)
3005 Power Supply Current
3006 High level output voltage
3007 Low level output voltage
3008 Input or Output Breakdown Voltage
3009 Low level input current
3010 High level input current
3011 Output short circuit current
3012 Terminal capacitance
3014 Functional testing
3016 Activation time verification
3018 Crosstalk measurements for digital devices
3020 High impendence low-level output leakage current
3021 High impendence high-level output leakage current
3022 Input clamp voltage
4001 Input offset voltage and bias current
4002 Phase margin and slew rate
4003 Common mode and power supply rejection ratios
4004 Open loop performance
4005 Output performance
4007 Automatic gain control range
*The Defense Logistics Agency has issued ACT a Land and Maritime-VQ letter of suitability for testing to these methods.
Related Links: 8 MIL-STD-202 8 MIL-STD-750 8 Military Test Plans