ACT Announces Expansion of its Scope of ISO 17025 Accreditation

ACT Announces Expansion of its Scope of ISO 17025 Accreditation

Ronkonkoma NY, May 2013 – Advanced Component Testing is excited to announce the expansion of its scope of ISO 17025 accreditation. This is an enhancement to their already large selection of testing services. The lab was developed to meet the overwhelming demand for testing and component authenticity services in the electronic components sector.

ACT is at the forefront of technical competence in testing and component authenticity of electronic components within the mil-aerospace, commercial, medical and automotive industries.

Advanced Component Testing is dedicated to broadening their electronic component testing capabilities by offering the latest in testing techniques. Services included in the new scope of ISO 17025 accreditation: Elemental Content by XRF, Radiographic Examination/Inspection, Visual Inspection, Resistance to Solvents, Packaging Configuration and Dimensions, Solderability, Dynasolve, and Decapsulation and Die Verification.

This expansion in ACT’s scope of accreditation services is something they are particularly proud of. “We are very excited to be expanding and enhancing our range of accreditations in order to provide the best and most complete testing and component authenticity services to our customers. ACT is dedicated to using the most current counterfeit detection technology combined with our proprietary database, experienced engineers, testing procedures and state of the art equipment to make ACT a leader in detection counterfeit components” stated Mike Zambito, VP of Operations for Advanced Components Testing.

This latest expansion in scope of accreditation now gives Advanced Component Testing an advantage to offer their customers a wider range of testing services. ACT’s project management and logistic experience provides a consistent and systematic approach to their testing each and every time.

About ACT’s Product Authenticity Services:

Functional Testing, Group A Electrical Testing, Solderability, Decapsultation/De-lidding, Internal Visual Die Inspection, Material Analysis/Device Composition, Component Surface Inspection, X-ray Die Bond and Frame Inspection, Physical Dimension, Marking Permanency, XRF Spectrum Analysis, Comprehensive report, Proprietary OCM Die database, Engineering review, Bake/Dry Pack, Tape/Reeling, Device Programming.

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Media Contact:
Shauna Ryan
Advanced Component Testing

(631) 676-6390



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