Additional Testing Capabilities
Advanced Component Testing offers a number of additional services above and beyond our electrical and authenticity tests. Our seasoned technicians and engineers can perform a variety of analyses, tests and services in high demand by our commercial, industrial and military customers. At ACT, we are continually expanding our offering so if your company needs a service that is not on the list below, please contact us to verify whether or not we are able to provide it.
- Destructive Physical Analysis (DPA)
- Fine/Gross Leak Testing
- Solderability Testing (more info below)
- Device Programming/Blank Verification
- Temperature Cycling
- Bake/Dry Pack
- Failure Analysis
- Tape and Reeling
Solderability Testing by ACT
Making sure devices can be properly soldered prior to production.
Solderability testing is a destructive test during which the leads of electronic component are evaluated as to whether or not storage has had an effect on the ability to solder them to an interconnecting substrate. It’s an especially critical service that should be considered before buying or utilizing any electronic component that may be older than two years or that you suspect may have been exposed to air contaminants, moisture and/or improper handling. Solderability testing is also a common flow-down requirement.
Advanced Component Testing can perform solderability tests on leaded and lead-free components in accordance with MIL-STD-883 Method 2003 (as per our ISO 17025 certification), MIL-STD-202 Method 208H and J-STD-002B. At ACT, a typical sample of three devices (or 15 leads) are preconditioned (steam aged) prior to testing. A dipping mechanism capable of controlling the rates of immersion and emersion of the terminations provides a dwell time in the solder bath at the required depth. As a result, ACT either confirms the existence of a uniform, smooth and unbroken film of solder that exhibits excellent adherence on the soldered surface OR that the leads have been compromised by oxidation or some other contaminant and thus should be retinned (or the devices replaced).
By knowing whether or not there’s a problem with the leads, production can be streamlined and performance issues averted.
Solderability testing is a destructive test during which the leads of electronic component are evaluated as to whether or not storage has had an effect on the ability to solder them to an interconnecting substrate. It’s an especially critical service that should be considered before buying or utilizing any electronic component that may be older than two years or that you suspect may have been exposed to air contaminants, moisture and/or improper handling. Solderability testing is also a common flow-down requirement.
Advanced Component Testing can perform solderability tests on leaded and lead-free components in accordance with MIL-STD-883 Method 2003 (as per our ISO 17025 certification), MIL-STD-202 Method 208H and J-STD-002B. At ACT, a typical sample of three devices (or 15 leads) are preconditioned (steam aged) prior to testing. A dipping mechanism capable of controlling the rates of immersion and emersion of the terminations provides a dwell time in the solder bath at the required depth. As a result, ACT either confirms the existence of a uniform, smooth and unbroken film of solder that exhibits excellent adherence on the soldered surface OR that the leads have been compromised by oxidation or some other contaminant and thus should be retinned (or the devices replaced).
By knowing whether or not there’s a problem with the leads, production can be streamlined and performance issues averted.